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Headquarters address: No. 4708 Yungu Road, Economic and Technological Development Zone, Hefei City, Anhui Province, China
Produce address: Zhenping Technology Industrial Park, No. 4345 Tiandu Road, Hefei Economic and Technological Development Zone, Anhui Province, China
Water-cooled oxygen-free oven
Usage introduction: Mainly used for precision baking, drying, shaping and processing of molded solid baking, IC (DB/WB), FPD, high-precision electronic components, electronic ceramic materials, electrical products, materials, spare parts, etc.
Category:
Keywords: Semiconductor specific equipment
Description
Usage introduction: Mainly used for precision baking, drying, shaping and processing of molded solid baking, IC (DB/WB), FPD, high-precision electronic components, electronic ceramic materials, electrical products, materials, spare parts, etc.
circulatory system |
Hot air circulation system |
|
Performance parameters |
temperature range |
RT.+25℃-250℃ |
temperature fluctuation range |
±1%℃ (empty box test) |
|
temperature uniformity |
±2%℃ (empty box test) |
|
Heating time |
<30Min(175℃)&<40Min(200℃) |
|
Oven structure |
Inside and outside cavity of oven |
SUS304 mirror stainless steel, painted board, resin board |
Insulation Materials |
High density ceramic fiber cotton |
|
heating |
Dust-free heating wire or stainless steel heating tube |
|
cooling method |
Water cooling, air cooling, multi-section cooling |
|
model |
MOLJM series |
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