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Rapid reaction mesh belt furnace
Application areas: micro-assembly applications of patch components, modules, chips, and power devices
Category:
Keywords: Semiconductor specific equipment
Description
Application areas: micro-assembly applications of patch components, modules, chips, and power devices
Features:
Precise air introduction and sufficient glue removal
Infrared + air blast combination heats quickly and evenly
Modular heat capacity combination, high efficiency
HMI has built-in analytics, data and event logging
Can be customized to meet specific processing requirements
Specification |
Typical parameters |
Remark |
Maximum operating temperature (℃) |
400 |
|
Atmosphere of use |
N2/Air |
|
optional controls |
Precise temperature/dew point control/online detection of indicators |
|
Mesh belt width (mm) |
150-560 |
Note 1 |
Furnace height |
30-100 |
|
Temperature uniformity(℃) |
±1-5 |
Note 2 |
Control temperature zone |
3-9 |
|
cooling method |
Air convection/forced air cooling/water cooling |
|
Note 1: Typical mesh belt width is 150/250/350/500/650; |
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