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Fully automatic vacuum vertical oven
Fully automatic vacuum vertical oven
Category:
Keywords: Semiconductor specific equipment
Description
(1) Product usage: used in semiconductor and pan-semiconductor processes such as low-temperature baking, drying, water removal, curing, and debinding in a vacuum environment.
(2) Product features:
2.1. Integrated human-machine operating system, continuous automated production, high work efficiency, saving labor costs, electricity and process time.
2.2. Ceramic fin heater, ring-shaped surrounding heating;
2.3 Ultimate vacuum degree: ≤10pa; optional (oxygen content index: ≤50ppm at normal temperature; ≤30ppm at high temperature)
(3)Technical parameters
Handling products |
8/12inch wafer |
Throughput |
50PCS/tube 26PCS/tube |
|
heater |
Ceramic fin heater, ring-shaped surrounding heating |
|||
Feeding port |
2/3/4 |
Manipulator |
1/2 |
|
temperature range |
Long-term use temperature: 300℃, maximum temperature: 350℃ |
|||
Heating rate |
<8℃/min |
cooling rate |
<3℃/min |
|
heating power |
13kW (single furnace) |
Heating temperature zone |
4 |
|
Furnace temperature uniformity |
±2%℃ (200℃ constant temperature) |
Temperature control thermocouple |
K graduation |
|
Temperature control method |
SSR |
Program control |
PID control |
|
atmosphere control |
Multi-channel flow meter adjusts the inlet flow measurement range: 0-150L/min |
atmosphere |
N2 |
|
Exhaust system |
Set up an exhaust chimney at the top for waste gas emission and recovery |
(4)Control system
*The human-machine interface adopts touch screen mode
*The core controller adopts embedded controller
*Over-temperature protection is an independent detection device
*With oxygen content detection function
*Motion control is servo/stepper control unit
*Transmission is a professional wafer transfer robot
*The software has functions: temperature control, atmosphere control, process editing, data recording, and chart display.
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