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Fully automatic vertical stand tube furnace
Fully automatic vertical stand tube furnace
Category:
Keywords: Semiconductor specific equipment
Description
(1) Product usage:
Integrated circuit wafer glue, BPO glue/PI glue/BCB glue curing, IC (wafer, CMOS, Bumping, TSV, MEMS, fingerprint recognition, IGBT); integrated circuit wafer rapid annealing furnace/alloy furnace
(2) Product features:
2.1. Integrated human-machine operating system, continuous automated production, high work efficiency, saving labor costs, electricity and process time.
2.2.FEC heating, rapid temperature rise and good uniformity
2.3. Comes with self-cleaning function - high temperature cleaning
(3)Technical parameters
Handling products |
8/12inch wafer |
Throughput |
100pcs/tube, 75PCS/tube |
|
heater |
Round FEC heating plate |
|||
Feeding port |
2/3/4 |
Manipulator |
1/2 |
|
temperature range |
Long-term use temperature: 350℃, maximum temperature: 750℃ |
|||
Heating rate |
<8℃/min |
cooling rate |
<7℃/min |
|
heating power |
30kW (single furnace) |
Heating temperature zone |
3pcs/tube |
|
Furnace temperature uniformity |
±2℃ (350℃ constant temperature) |
Temperature control thermocouple |
K graduation |
|
Temperature control method |
SSR |
Program control |
PID control |
|
Furnace material |
quartz |
Insulation Materials |
Ceramic fiber |
|
atmosphere control |
Multi-channel flow meter adjusts the air intake: flow measurement range: 1) 0-150L/min nitrogen 2) 0-40L/min oxygen |
atmosphere |
N2/O2 |
|
Exhaust system |
Set up an exhaust chimney at the top for waste gas emission and recovery |
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